Flexible / Rigid flex

 

 

Layer 12
Material Basis FR 4, Polyamide
Copper 18 µm - 35 µm
Material thickness 25 µm, 50 µm, 70 µm
Conductor track width spacing 100 µm
Smallest drill 0,20 mm
Cut Milled
Tests Electronic
Execution Soldermask

 

Current

 

Custom-built PCB? Specific requirements?…
 
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